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Higgstec employs high-temperature processes, laser engraving, and optical bonding technologies to provide precise and durable solutions. Coupled with intelligent management and a dust-free, anti-static environment, we effectively shorten production cycles, ensuring product quality and stability.
Compared to low-temperature processes, Higgstec's five-wire resistive products use a rare high-temperature sintering process (500℃) to sinter circuits with ITO glass, enabling long-term application in harsh environments.
Using fine engraving technology, 45µm (line width) / 35µm (line spacing), to etch extremely fine circuits, meeting customer demands for ultra-narrow bezel design.
Suitable for small-volume, high-mix production.
By optical performance and make the products' visual presentation more outstanding.
To meet diverse customer demands, Higgstec can quickly switch production lines for different products to accommodate varied order requirements, allowing customers to flexibly choose different hardware specifications.
Establishing high-standard environments to ensure excellent quality.